 | TEL：0755-29851565 |
 | E-mail：see contact us |
Address: Building 5, Zhengzhong Industrial Park, Dayangtian, Fuyong Town, Bao'an District, Shenzhen, China
Tel: 0755-29851556
Fax: 0755-29851539
E-mail:linxinxiang@126.com
Website: www.qzepa.com
Product ID: | XNTMKSIMTF-NOTE3 |
product name: | microSim8Pin+TF8Pin No-push (H=2.26) |
specification: | Plastic: white high temperature UL94V-0; terminal: copper alloy; shell: stainless steel |
Product Note: | Two in one with CD terminal, L13.00*W18.30*H2.26 |
Product Category: | SIM microSim NanoSIM |
Technical parameters:
1. Rated current: 0.5A AC/DC
2. Rated voltage: 30V AC/DC
3. Operating temperature: -25°C ~ +70°C
4. Storage temperature: -25°C ~ +70°C
5. Contact resistance :50m ohms max.
6. Withstanding voltage: 100V AC / 1 minute
7. Insulation resistance: 100M ohms min./500VDC
8. Durability: microSIM 3000, microSD 5000 times
9. Product temperature resistance: 260±5°C 10S
10 Flatness: 0.10mm MAX.
11. RoHS compliant
12. Stable performance.
Product Description:
1. This connector is widely used in mobile phones, tablet PCs, navigators, LCD TVs, automobiles, aviation, smart wearable devices, etc.
2 This product inspection process is: IQC feed inspection -> warehousing -> pre-line self-test -> IPQC inspection -> FQC final inspection -> OQC cargo inspection
3. This product production process is: on-line Pre-inspection-->Bags-->Assembled microSIM shell-->Assembled microSD shell-->Card test-->Electrical test-->Flatness test-->Positive test-->Appearance test -->FQC Inspection --> Storage
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