Address: Building 5, Zhengzhong Industrial Park, Dayangtian, Fuyong Town, Bao'an District, Shenzhen, China
Tel: 0755-29851556
Fax: 0755-29851539
E-mail:linxinxiang@126.com
Website: www.qzepa.com
Product ID: | XNT-SIM-TF-111169 |
product name: | Combo combo sim+microSD push type has CD |
specification: | Plastic: black high temperature UL94V-0; terminal: copper alloy; shell: stainless steel |
Product Note: | CD terminal, SMT type L17.00*W16.50*H2.70 |
Product Category: | SIM microSim NanoSIM |
Technical parameters:
1. Rated current: 0.5A AC/DC
2. Rated voltage: 5V AC/DC
3. Operating temperature: -55°C ~ +85°C
4. Storage temperature: -55°C ~ +85°C
5. Contact resistance : 100m ohms max.
6. Withstand voltage: 250V AC / 1 minute
7. Insulation resistance: 500M ohms min./500VDC
8. Durability times: Sim 5000 times microSD 5000 times
9. Product temperature resistance: 260±5°C 10S
10. Flatness: 0.10mm MAX.
11. RoHS compliant
12. Stable performance.
Product Description:
1. This connector is widely used in mobile phones, tablet PCs, navigators, LCD TVs, automobiles, aviation, smart wearable devices, etc.;
2. This product inspection process is: IQC feed inspection -> into the warehouse -> pre-line self-test -> IPQC inspection -> FQC final inspection -> OQC out of cargo inspection
3. This product production process is: before the on-line Inspection-->Cutting tape-->Assembly hook-->Assemble slider, tie rod, spring-->Assemble microSD shell-->Assemble Sim shell-->Push inspection-->Electrical inspection-->Flatness Inspection-->Positiveity Test-->Appearance Test-->FQC Test-->Storage