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 | E-mail：see contact us |
Address: Building 5, Zhengzhong Industrial Park, Dayangtian, Fuyong Town, Bao'an District, Shenzhen, China
Tel: 0755-29851556
Fax: 0755-29851539
E-mail:linxinxiang@126.com
Website: www.qzepa.com
Product ID: | XNT-SIM-111115 |
product name: | 6Pin 1.30mm height No-push micro Sim connector |
specification: | Plastic: black high temperature UL94V-0; terminal: copper alloy; shell: stainless steel |
Product Note: | Without CD terminal, L15.10*W13.00*H1.30 |
Product Category: | SIM microSim NanoSIM |
Technical parameters:
1. Rated current: 0.5A AC / DC
2. Operating temperature: -30 °C ~ +85 °C
3. Storage temperature: -30 °C ~ +85 °C
4. Contact resistance: 30m ohms max.
5. Withstand voltage : 500V AC / 1 minute
6. Insulation resistance: 500M ohms min./500VDC
7. Durability: microSIM 3000 times
8. Product temperature resistance: 250±5°C 10S
9. Flatness: 0.10mm MAX.
10. RoHS compliant
11 Stable and superior performance
Product Description:
1. This connector is widely used in mobile phones, tablet computers, navigators, LCD TVs, automobiles, aviation, smart wearable devices, etc.;
2. This product inspection process is: IQC feed inspection - > Storage -> Pre-line self-test -> IPQC inspection -> FQC final inspection -> OQC cargo inspection
3. This product production process is: pre-line inspection -> Binder ribbon -> assembly microSIM Shell-->card test-->electrical test-->flatness test-->positive test-->appearance test-->FQC test-->storage
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