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Shenzhen Xin Nan Tian Technology Co., Ltd.

Address: Building 5, Zhengzhong Industrial Park, Dayangtian, Fuyong Town, Bao'an District, Shenzhen, China

Tel: 0755-29851556  

Fax: 0755-29851539

E-mail:linxinxiang@126.com

Website: www.qzepa.com



昆山Combo combo sim+microSD push type has CD

  • category:昆山Sim Series

  • The number of clicks:
  • Release date:2018/06/22
  • Inquiry
details
Product ID:
XNT-SIM-TF-111169
product name:
Combo combo sim+microSD push type has CD
specification:
Plastic: black high temperature UL94V-0; terminal: copper alloy; shell: stainless steel
Product Note:
CD terminal, SMT type L17.00*W16.50*H2.70
Product Category:
SIM microSim NanoSIM


Technical parameters: 
1. Rated current: 0.5A AC/DC  
2. Rated voltage: 5V AC/DC 
3. Operating temperature: -55°C ~ +85°C 
4. Storage temperature: -55°C ~ +85°C 
5. Contact resistance : 100m ohms max. 
6. Withstand voltage: 250V AC / 1 minute 
7. Insulation resistance: 500M ohms min./500VDC 
8. Durability times: Sim 5000 times microSD 5000 times 
9. Product temperature resistance: 260±5°C 10S 
10. Flatness: 0.10mm MAX. 
11. RoHS compliant 
12. Stable performance. 
Product Description: 
1. This connector is widely used in mobile phones, tablet PCs, navigators, LCD TVs, automobiles, aviation, smart wearable devices, etc.; 
2. This product inspection process is: IQC feed inspection -> into the warehouse -> pre-line self-test -> IPQC inspection -> FQC final inspection -> OQC out of cargo inspection 
3. This product production process is: before the on-line Inspection-->Cutting tape-->Assembly hook-->Assemble slider, tie rod, spring-->Assemble microSD shell-->Assemble Sim shell-->Push inspection-->Electrical inspection-->Flatness Inspection-->Positiveity Test-->Appearance Test-->FQC Test-->Storage



XNT-SIM-TF-111169.pdf


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